Park Systems has introduced the revolutionary Park
3DM Series, the completely automated AFM system
designed for overhang profiles, high-resolution
sidewall imaging, and critical angle measurements.
With the patented decoupled XY and Z scanning
system with tilted Z-scanner, it overcomes the
challenges of the normal and flare tip methods in
accurate sidewall analysis. In utilizing our True Non-Contact
Mode™, the Park 3DM Series enables
non-destructive measurement of soft photoresist
surfaces with high aspect ratio tips.
A fully automated industrial AFM
using NX technology
Clean room compatible and fully automated for measurement
and data analysis at the nanoscale level
NX technology automatically constructs an extremely accurate
topographical image and collects essential dimensional data
The Industry leading,low noise Z-detector works on an
independent, closed loop to minimize errors in topography
(the “creep effect”)
True Non-contact™ mode allow for the collection of high
resolution and accurate data without tip-sample damage,
something that could otherwise cost you valuable time and
money
Innovative head design for undercut
and overhang structures
Z-head’s unique sideways orientation allows access to the
undercut and overhang structures of photoresist and other
industrial material
Patented decoupled XY and Z scanning systems work together
with the tilted Z-scanner, letting users overcome normal
challenges in accurate sidewall analysis associated with
normal and flare tip methods
Sidewall trench line profile, roughness, critical angle and
critical dimension can all be measured using the NX-3DM
Z-head tilting mechanism allows access to the sidewalls
using an ultra-sharp tip to obtain the same high resolution
and definition as is obtained over the rest of the material
A Reliable, Seamless Measurement
Tool for 3D materials
No sample preparation (eg. cutting, mounting or coating) is
required to obtain the sidewall roughness or critical
dimension measurements in this process
By utilizing Z-head tilting and True Non-contact™ mode, the
NX-3DM allows for both tip-preserving and high resolution
collection of sidewall data
An innovative 3D
metrology solution
Undercut and Overhang Profiling
The NX-3DM allows unique access to the undercut
and overhang structures of photoresist and other
industrial materials, ensuring users receive
accurate topographical data throughout the entire sample.
The NX-3DM’s innovative head tilting design allows
access to the sidewalls using an ultra sharp tip to
obtain high resolution, well-defined details of
the area and its roughness. Innovative head tilting
design allows access to the sidewalls using ultra
sharp tip to obtain high resolution and
(more defined)details of the side wall roughness.
The many unique features of the NX-3DM are
made possible by independently tilting the Z-scanner in
its patented Crosstalk Eliminated
platform, where XY and Z scanners are completely
decoupled. This design allows users to access the
vertical sidewalls as well as theundercut structures
at various angles. Unlike in systems with flared
tips, here high resolution and high aspect ratio probes
can be used.
The 100 μm x 100 μm XY scanner consists of a
symmetrical 2-dimensional flexure stage and high-force
piezoelectric stacks that provide highly
orthogonal movement with minimal out-of-plane
motion, as well as the high responsiveness
essential for precise sample scanning at the
nanometer scale.
The NX-3DM is equipped with automated software
that makes operation seamless. Just select the
desired measurement program to get precise
multi-site analysis and auto-optimized settings for
cantilever tuning, scan rate, gain, and set-point
parameters. Park's user-friendly software interface
gives you the flexibility to create customized
operation routines so you can make the most of
the NX-3DM with the least amount of effort.
Creating new routines is easy. On average it takes
only 10 minutes to make a new routine, and less
than 5 to modify an existing one.
Our AFMs are equipped with the most effective
low noise Z detectors in the field, with a noise of
0.2 Å over large bandwidth. This produces
highly accurate sample topography, no edge
overshoot and no need for calibration. Just one of
the many ways Park NX-3DM saves you time and gives you
better data.
Accurate Sample Topography Measured by Low Noise Z Detector
No artifact by AFM scanner in low noise closed-loop topography
Uses low noise Z detector signal for topography
Has low Z detector noise of 0.02 nm over large bandwidth
Has no edge overshoot at the leading and trailing edges
Needs calibration done only once at the factory
To detect the smallest sample features, and image
the flattest surfaces, Park has engineered the
industry’s lowest noise floor specification of < 0.5
Å. The noise floor data is determined using a
“zero scan.” The system noise is measured with the
cantilever in contact with the sample surface at a
single point under the following conditions :
0 nm x 0 nm scan, staying at one point.
0.5 gain in contact mode
256 x 256 pixels
Due to the ever-decreasing size of components,
manufacturers now require the highest level of
quality control. Park AFM can provide 1 gauge
sigma of less than 1 angstrom.
Thanks to Park's revolutionary AFM platform
designed for industrial metrology, Park NX-3DM
will correlate with any existing Park AFMs that have
been previously used for manufacturing, inspection,
analysis, or research.
A revolutionary
all-in-one system for
3D Metrology
Automatic Tip Exchange (ATX)
The ATX automatically locates tips by pattern
recognition and uses a novel magnetic approach to
disengage a used tip and pick up a new tip, with an
incredible 99.9% success rate. The laser spot is
then automatically optimized along the X- and Y-axis by
motorized positioning knobs.
Ionization System for a more stable scanning environment
Our innovative ionization system quickly and
effectively removes electrostatic charges in your
sample's environment. Since the system
always generates and maintains the ideal balance
of positive and negative ions, it can create an
extremely stable charge environment with little
contamination of the surrounding area and
minimal risk of accidental electrostatic charge during
sample handling.
Automatic Wafer Handler (EFEM or FOUP)
The NX-3DM can be configured for various
automatic wafer handlers, such as EFEM and
FOUP. The high-precision, robotic handling arm
ensures users get fast and reliable wafer measurements
every time.
